Extreme Tech Challenge Semiconductors and AI Innovation Reception

Foley & Lardner has teamed up with Extreme Tech Challenge, ARM, Hon Hai Technology Group (Foxconn), and CBRE to gather the deep tech and climate community to share thought leadership, enable network building, and catalyze partnerships and engagements among the guests.

The 8 startup finalists of the Extreme Tech Challenge Semiconductors and AI Startup Cup will also be announced.

Why Attend?

Be Inspired: Hear from experts in this space.

Discover Innovation: Meet the XTC Startup Cup Top 8 Semifinalists. Witness groundbreaking solutions in Semiconductors & Ecosystem and AI & Data Infrastructure that are unlocking new possibilities for climate action.

Network with leaders in climate innovation: Connect with leading corporate leaders, VCs, startup founders, startup ecosystem builders, and public sector stakeholders in this space.

Programme

5:00: Arrival
5:00 – 5:30: Welcome Reception
5:30 – 5:35: Opening Remarks (Victoria Slivkoff, Young Sohn, Bill Tai)
5:35 – 5:55: Fireside Chat | Powering the Future: Navigating AI’s Energy Demands for a Sustainable Tomorrow with Young Sohn
5:55 – 6:05: Announcing the startup finalists of the Semiconductors and AI Startup Cup with remarks from sponsors including Will Abbey (EVP, Chief Commercial Officer, Arm) and Jerry Hsaio (CPO, Hon Hai Technology Group (Foxconn)
6:05 – 6:30: Panel Discussions on Chips and Infrastructure moderated by Jonathan Charles (VC, Samsung Catalyst Fund)
6:30 – 6:55: Panel Discussion on Connectivity moderated by Francis Ho (Partner, Walden Catalyst Ventures with guests Alan Liu (CEO & Co-Founder, Quintessent) and Syrus Ziai (VP of Engineering, Eliyan)
6:55 – 7:00: Closing remarks
7:00 – 8:00: Networking Reception

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