Foley Client Vicor Opens First-Ever Chip Fabrication Facility

Foley & Lardner LLP client Vicor, a leader in high-performance power modules, opened a new, state-of-the-art power module manufacturing facility. The opening comes after Foley advised Vicor on a secondary public offering that helped fund the facility. The facility is the world’s first Converter housed in Package (“ChiP”) fabrication facility (“ChiP fab”) and enables scalable, automated, cost-effective manufacturing of power modules in the United States. The opening occurs during Vicor’s 41-year milestone of expanding performance leadership within the global power electronics industry with domestic manufacturing.

The facility marks a significant step in accomplishing Vicor’s vision to enable high-performance, modular power system solutions that satisfy ever-increasing power demands. Vicor has successfully done this by integrating all stages of the manufacturing process, creating the most power-dense and energy-efficient solutions.

Vicor aims to advance the density, efficiency, and power delivery capabilities of its power modules by staying at the forefront of distribution architectures, conversion topologies, and packaging technology, serving customers in enterprise and high-performance computing, industrial equipment and automation, robotics, UAVs, vehicles and transportation, satellites, and aerospace and defense industries. Vicor’s vertically-integrated foundry delivers new capacity to manufacture power modules for artificial intelligence, electrified vehicles, advanced communications, and other high-growth markets.

The Foley team was led by Partners Gabor Garai and Mark Plichta and Associate Katie Conterio.

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