William Paltz is a patent agent with Foley & Lardner LLP. He is a member of the firm’s Mechanical & Electromechanical Technologies Practice. Will has experience preparing and prosecuting domestic and international patent applications across a variety of technology areas, including data science and analytics, computer modeling and artificial intelligence/machine learning, security systems and software, medical devices, advertisements and marketing, financial technologies, business methods, and electromechanical control systems.
Prior to joining Foley, Will was a control hardware engineer at Rockwell Automation, where he was responsible for field-programmable gate array (FPGA) design and development activities. Will was also a software and firmware quality engineer at Rockwell Automation, where he contributed to a variety of projects including backend development, and software and firmware development lifecycle optimization.
Will is currently attending Southern Methodist University (SMU) Dedman School of Law.