William C. Paltz

Patent Agent I


William Paltz is a patent agent with Foley & Lardner LLP. He is a member of the firm’s Mechanical & Electromechanical Technology Practice.

Prior to joining Foley, Will worked at Rockwell Automation as a software and firmware quality engineer, then as a control hardware electrical engineer. During his time with Rockwell Automation, Will covered a workload including oversight of software and firmware development lifecycle, backend development, field-programmable gate array (FPGA) development, and implement version controls.

While completing his degree in computer engineering, Will gained experience in data structures & algorithms, computer architecture, processor design, and semiconductor fabrication.

In addition, Will has experience in patent prosecution and legal writing.


  • University of Wisconsin, (B.S., summa cum laude, 2019)
    • Computer Engineering
    • Member, Institute of Electrical and Electronics Engineers (IEEE)
    • College of Engineering & Applied Science Dean’s List (2015-2019 Academic Years)


  • U.S. Patent and Trademark Office (USPTO)