Chase J. Brill

Senior Counsel


Chase Brill is a senior counsel and intellectual property lawyer with Foley & Lardner LLP. Mr. Brill counsels clients on intellectual property matters, including patent prosecution, patent enforcement and licensing, defense of infringement allegations, due diligence investigations, product clearance, and litigation. He is a member of the firm’s Mechanical & Electromechanical Technologies Practice and Patent Office Trials Group. He has significant experience with complex U.S. Patent Office proceedings, including inter partes review trials and ex parte and inter partes reexamination.

Mr. Brill counsels clients in a wide variety of technological fields, including semiconductor devices, medical devices, microfluidic devices, nanotechnology, printing devices, audio-visual systems, augmented reality devices, fuel cells, engine components, vehicle control systems, automotive aftertreatment systems, heating and air conditioning systems, lubricants and low-friction assemblies, and integrated circuit test handlers, food and drink manufacturing systems.


Mr. Brill earned his law degree from Georgetown University Law Center (J.D., 2009), where he was an editor of both the Georgetown Law Journal and the Annual Review of Criminal Procedure.

Mr. Brill received his bachelor’s degree in mechanical engineering from Northwestern University (B.S., 2006).

Admissions and Professional Memberships

Mr. Brill is admitted to practice in the District of Columbia and Illinois as well as before the Court of Appeals for the Federal Circuit and the United States Patent and Trademark Office. He is a member of the ABA Section of Intellectual Property Law and Section of Science and Technology Law, a member of the American Intellectual Property Law Association, and a committee member on the Ex Parte Appeals Committee of the PTAB Bar Association.


2019 Foley Tokyo IP Conference
16 October 2019
PTAB - A Year in Review
10 January 2019
Global Relationships In Flux – How Would You Redraw Your IP Strategy Map?
11 October 2018
AI on the Move
14 and 15 March 2018
Osaka and Tokya, Japan